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Reverse-engineering of Solder Mask #89

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Kreyren opened this issue Apr 12, 2021 · 1 comment
Open

Reverse-engineering of Solder Mask #89

Kreyren opened this issue Apr 12, 2021 · 1 comment
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@Kreyren
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Kreyren commented Apr 12, 2021

Issue dedicated to reverse-engineering the composition with the intention to improve it


image

Solder Mask is used to cover up exposed copper tracks on a Printed Circuit Boards as shown in https://youtu.be/M3VEmBE2Nh0?t=2619 which hardens under UV light and bubbles at 300C.

Available online on e.g. https://www.hotair.cz/detail/pasty-ciny-lepidla/uv-vytvrditelny-lak-pro-nepajivou-masku-cerny.html

Expectations

  1. electrically insulating liquid used to protect the copper tracks on fibreglass board.

  2. Does not interfiere with SMD soldering using direct heat of +235~300 C to melt lead/tin with the use of "flux" (liquid that transfers the heat evenly and evaporates at +-280 C).

  3. Doesn't react with isopropyl alcohol used in supersonic cleaner to clean the board.

Motivation

@Kreyren Kreyren self-assigned this Apr 12, 2021
@Kreyren
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Kreyren commented Apr 12, 2021

Relevant: The solder mask is pressumably a photopolymer (https://en.wikipedia.org/wiki/Photopolymer)

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