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Pull request #21: Develop to Master
Merge in MCU16CE/dspic33e-code-examples from develop to master * commit 'f2b250336090444b2892a126c0eedabc98c6d0c6': (30 commits) Updated README Updated the description Updated Readme file Updated Readme file Updated Readme file Updated review comments Updated review comments Updated review comments Updated review comments Updated review comments Updated review comments Addressed review comments Addressed review comments Addressed review comments Addressed review comments Addressed review comments Addressed review comments CITD-425:Updated content version CITD-425:Updated content version CITD-425:Updated content version ...
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‎.main-meta/main.json

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"content":{
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"metaDataVersion":"1.3.0",
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"name":"com.microchip.mplabx.project.dspic33e-code-examples",
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"version":"0.1.0",
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"displayName":"DSPIC33E Code Examples",
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"version":"1.0.0",
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"displayName":"dsPIC33E Code Examples",
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"projectName":"dspic33e-code-examples",
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"shortDescription":"DSPIC33E Code Examples",
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"shortDescription":"dsPIC33E Code Examples",
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"ide":{
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"name":"MPLABX",
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"semverRange":">=5.50.0"
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"semverRange":">=6.00"
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},
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"compiler":{
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"name":"XC16",
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"semverRange":"^1.50.0"
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"semverRange":"^2.00"
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},
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"dfp":{
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"name":"dsPIC33E-GM-GP-MC-GU-MU_DFP",
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"content":{
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"metaDataVersion":"1.0.0",
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"category":"com.microchip.device",
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"name":"DSPIC33EP512GM710",
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"name":"dsPIC33EP512GM710",
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"versionRange":"*"
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}
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},

‎README.md

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![image](images/microchip.jpg)
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## DSPIC33E CODE EXAMPLES
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## dsPIC33E Code Examples
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This repository contains the code examples for DSPIC33E Device Families.
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This repository contains the code examples for dsPIC33E device families.
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‎changelog.md

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# DSPIC33E Code Examples v0.1.0
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# dsPIC33E Code Examples v0.1.0
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### Release Highlights
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Initial Release of DSPIC33E code examples on GitHub.
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Initial Release of dsPIC33E code examples on GitHub.
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‎dspic33e-adc-1msps/.main-meta/main.json

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"content":{
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"metaDataVersion":"1.3.0",
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"name":"com.microchip.mplabx.project.dspic33e-adc-1msps",
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"version":"0.1.0",
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"version":"1.0.0",
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"displayName":"ADC Sampling at 1.1MSPS",
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"projectName":"dspic33e-adc-1msps",
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"shortDescription":"ADC Sampling at 1.1MSPS",
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"ide":{
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"name":"MPLABX",
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"semverRange":">=5.50.0"
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"semverRange":">=6.00"
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},
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"compiler":{
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"name":"XC16",
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"semverRange":"^1.70.0"
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"semverRange":"^2.00"
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},
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"dfp":{
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"name":"dsPIC33E-GM-GP-MC-GU-MU_DFP",
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"content":{
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"metaDataVersion":"1.0.0",
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"category":"com.microchip.device",
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"name":"DSPIC33EP512GM710",
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"name":"dsPIC33EP512GM710",
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"versionRange":"*"
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}
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},

‎dspic33e-adc-1msps/README.md

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at 1.1MHz throughput rate. ADC clock is configured at 13.3Mhz or Tad=75ns
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ADC Conversion Time for 10-bit conversion is Tc=12 * Tab = 900ns (1.1MHz).
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void initAdc1(void);
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void initAdc1(void);
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ADC CH0 and CH1 S/H is set-up to covert AIN0 in 10-bit mode. ADC is configured to next sample data immediately after the conversion.
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So, ADC keeps conversion data through CH0/CH1 S/H alternatively. Effective conversion rate is 1.1Mhz
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void initDma0(void);
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void initDma0(void);
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DMA channel 0 is configured in ping-pong mode to move the converted data from ADC to DMA RAM on every sample/convert sequence.
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It generates interrupt after every 16 sample transfer.
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void \__attribute\__((\__interrupt\__)) _DMA0Interrupt(void);
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void \_\_attribute\_\_((\_\_interrupt\_\_)) _DMA0Interrupt(void);
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DMA interrupt service routine, moves the data from DMA buffer to ADC signal buffer and collects 256 samples.
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The Toggle frequency of one pulse should be around 240us(micro second), if the operating clock frequency at 40Mhz.
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## Software Used
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- MPLAB® X IDE v5.50 or newer (https://www.microchip.com/mplabx)
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- MPLAB® XC16 v1.70 or newer (https://www.microchip.com/xc)
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- MPLAB® X IDE v6.00 or newer (https://www.microchip.com/mplabx)
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- MPLAB® XC16 v2.00 or newer (https://www.microchip.com/xc)
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‎dspic33e-adc-altsamp/.main-meta/main.json

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{
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"metaDataVersion":"1.0.0",
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"category":"com.microchip.ide.project",
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"content":{
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"metaDataVersion":"1.3.0",
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"name":"com.microchip.mplabx.project.dspic33e-adc-altsamp",
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"version":"1.0.0",
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"displayName":"ADC Alternate Sampling",
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"projectName":"dspic33e-adc-altsamp",
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"shortDescription":"ADC Alternate Sampling",
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"ide":{
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"name":"MPLABX",
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"semverRange":">=6.00"
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},
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"compiler":{
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"name":"XC16",
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"semverRange":"^2.00"
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},
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"dfp":{
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"name":"dsPIC33E-GM-GP-MC-GU-MU_DFP",
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"semverRange":"^1.3.85"
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},
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"device":{
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"metaDataVersion":"1.0.0",
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"category":"com.microchip.portal.contentRef",
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"content":{
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"metaDataVersion":"1.0.0",
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"category":"com.microchip.device",
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"name":"dsPIC33EP512MU810",
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"versionRange":"*"
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}
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},
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"peripherals":[
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"TMR",
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"DMA",
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"ADC"
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],
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"keywords":[
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"TMR",
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"DMA",
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"ADC"
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]
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}
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}

‎dspic33e-adc-altsamp/README.md

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![image](../images/microchip.jpg)
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## ADC Alternate Sampling
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## Description:
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In this example, Timer 3 is setup to time-out every 125 microseconds (8Khz Rate).
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As a result, the module will stop sampling and trigger a A/D conversion on every Timer3 time-out, i.e., Ts=125us.
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ADC is configured in 10bit mode to alternatively sample AN4/AN5 analog input on Timer 3 interrupt.
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It will take TWO Timer3 Timeout period to sample AN4 first and then AN5.
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ADC module clock time period is configured as Tad=Tcy*(ADCS+1)= (1/60M)*64 = 1.06us (625Khz).
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Hence the conversion time for 10-bit A/D Conversion Time Tc=12*Tad = 12.72us
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DMA is used to sort and transfer the converted data to DMA RAM. DMA is configured in ping-pong mode
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and it transfers 16samples of each of the TWO analog inputs and generates interrupt.
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DMA channel 0 is configured in ping-pong mode to move the converted data from ADC to DMA RAM
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on every sample/convert sequence.
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First, DMA uses DMA0STA base address to store the ADC samples and it generates interrupt
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after transfering (TWO x 16 samples = 32 samples).
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Next, DMA uses DMA0STB base address to store the ADC samples and it generates interrupt
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after transfer (TWO x 16 samples = 32 samples).
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Above process repeats continuously.
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void \_\_attribute\_\_((\_\_interrupt\_\_)) _DMA0Interrupt(void);
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DMA interrupt service routine, moves the data from DMA buffer to ADC signal buffer
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Timer time outs at 60M/(4999+1) = 12000 Hz.
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DMA interrupt @ 12K/32= 375 Hz.
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I/O pin toggles at 375/2= 187 Hz.
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RA4 pin is toggled in ISR, hence it will be toggling at ~ 187Hz
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## Hardware Used
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- Explorer 16/32 Development Board (https://www.microchip.com/DM240001-2)
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- dsPIC33EP512GM710 PIM (https://www.microchip.com/ma330035) or dsPIC33EP512MU810 PIM (https://www.microchip.com/MA330025-1) or dsPIC33EP256GP506 PIM (https://www.microchip.com/MA330030)
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## Software Used
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- MPLAB® X IDE v6.00 or newer (https://www.microchip.com/mplabx)
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- MPLAB® XC16 v2.00 or newer (https://www.microchip.com/xc)
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‎dspic33e-adc-altsamp/firmware/dspic33e-adc-altsamp.X/Makefile

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#
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# There exist several targets which are by default empty and which can be
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# used for execution of your targets. These targets are usually executed
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# before and after some main targets. They are:
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#
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# .build-pre: called before 'build' target
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# .build-post: called after 'build' target
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# .clean-pre: called before 'clean' target
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# .clean-post: called after 'clean' target
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# .clobber-pre: called before 'clobber' target
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# .clobber-post: called after 'clobber' target
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# .all-pre: called before 'all' target
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# .all-post: called after 'all' target
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# .help-pre: called before 'help' target
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# .help-post: called after 'help' target
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#
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# Targets beginning with '.' are not intended to be called on their own.
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#
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# Main targets can be executed directly, and they are:
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#
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# build build a specific configuration
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# clean remove built files from a configuration
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# clobber remove all built files
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# all build all configurations
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# help print help mesage
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#
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# Targets .build-impl, .clean-impl, .clobber-impl, .all-impl, and
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# .help-impl are implemented in nbproject/makefile-impl.mk.
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#
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# Available make variables:
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#
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# CND_BASEDIR base directory for relative paths
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# CND_DISTDIR default top distribution directory (build artifacts)
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# CND_BUILDDIR default top build directory (object files, ...)
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# CONF name of current configuration
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# CND_ARTIFACT_DIR_${CONF} directory of build artifact (current configuration)
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# CND_ARTIFACT_NAME_${CONF} name of build artifact (current configuration)
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# CND_ARTIFACT_PATH_${CONF} path to build artifact (current configuration)
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# CND_PACKAGE_DIR_${CONF} directory of package (current configuration)
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# CND_PACKAGE_NAME_${CONF} name of package (current configuration)
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# CND_PACKAGE_PATH_${CONF} path to package (current configuration)
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#
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# NOCDDL
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# Environment
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MKDIR=mkdir
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CP=cp
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CCADMIN=CCadmin
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RANLIB=ranlib
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# build
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build: .build-post
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.build-pre:
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# Add your pre 'build' code here...
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.build-post: .build-impl
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# Add your post 'build' code here...
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# clean
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clean: .clean-post
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.clean-pre:
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# Add your pre 'clean' code here...
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# WARNING: the IDE does not call this target since it takes a long time to
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# simply run make. Instead, the IDE removes the configuration directories
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# under build and dist directly without calling make.
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# This target is left here so people can do a clean when running a clean
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# outside the IDE.
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.clean-post: .clean-impl
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# Add your post 'clean' code here...
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# clobber
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clobber: .clobber-post
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.clobber-pre:
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# Add your pre 'clobber' code here...
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.clobber-post: .clobber-impl
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# Add your post 'clobber' code here...
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# all
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all: .all-post
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.all-pre:
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# Add your pre 'all' code here...
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.all-post: .all-impl
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# Add your post 'all' code here...
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# help
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help: .help-post
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.help-pre:
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# Add your pre 'help' code here...
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.help-post: .help-impl
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# Add your post 'help' code here...
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# include project implementation makefile
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include nbproject/Makefile-impl.mk
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# include project make variables
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include nbproject/Makefile-variables.mk

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