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Thermocouples are needed where dissipation or environment prevent the use of NTCs, RTDs, and diodes
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Maybe just add Maxim integrated AFEs with I2C?
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The goal would be to get better than the 16 mK ref junction resultion plus 8 mK TC resolution of that chip. But I agree that this may be marginal.
We already have 2 front-end board options. Maybe we should make them as a separate project...
Agreed
Moving TC and Cryo breakout to separate PCB project
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Thermocouples are needed where dissipation or environment prevent the use of NTCs, RTDs, and diodes
The text was updated successfully, but these errors were encountered: