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Moved and refactored NDopants, PDopants, and Photoresists logic into new semiconductor-focused modules: Deposition, Doping, Etching, Lithography, and Packaging. Updated and cleaned up etchant and photoresist handling, removed obsolete global files, and improved naming consistency. Adjusted material definitions and fixed minor issues in material property assignments. Updated language files and reorganized component and chemistry chains to match new structure.
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Overhauls all circuit progression as outlined.