feat: add cubie series Tina5.0 AIoT documentation link

docs/cubie/a5e/download.md

@@ -68,3 +68,61 @@ sidebar_position: 8
 - [原理图 V1.20](https://dl.radxa.com/cubie/a5e/docs/hw/v1.2/radxa_cubie_a5e_schematic_v1.2_20250113.pdf)
 - [位号图 V1.20](https://dl.radxa.com/cubie/a5e/docs/hw/v1.2/radxa_cubie_a5e_components_placement_map_v1.2_20250113.pdf)
 - [3D 文件 V1.20](https://dl.radxa.com/cubie/a5e/docs/hw/v1.2/radxa_cubie_a5e_pcba_3d_v1.2_stp_20250224.zip)
+
+## 参考资料
+
+### [Tina5.0 AIoT 文档](https://gitlab.com/tina5.0_aiot/product/docs/)
+
+:::tip
+
+[Tina5.0 AIoT 文档](https://gitlab.com/tina5.0_aiot/product/docs/) 以中文版本为主！
+
+:::
+
+该文档是全志 A 系列（A527、A733 等）与 T 系列（T527 等）芯片的配套技术支持文档体系，与 Tina5.0 AIoT 文档深度联动，覆盖芯片从 “硬件设计 → 软件开发 → 工具适配 → 量产落地” 的全生命周期，其核心目标用户包括：
+
+1. 硬件工程师：支撑硬件方案设计与落地
+
+2. Linux/AIoT 软件开发者：适配 Tina5.0 SDK 的驱动与应用开发
+
+3. 产线技术人员：解决量产环节的实操问题
+
+4. 合规采购人员：获取物料兼容性与环保认证信息
+
+#### 硬件类文档
+
+- 硬件物料清单
+
+明确芯片兼容的核心物料范围，含 Camera 模组、LCD/eDP 屏幕、Wi-Fi/BT 模块、Input Sensor、DRAM、eMMC/NAND 存储等的支持列表与选型指导，确保选型准确性。
+
+- 硬件设计资源
+
+提供可直接复用的设计模板与规范，包括标案原理图、开发板 / 原型机原理图、PCB 参考模板、设计指南及硬件 Checklist，同时配套 IBIS 模型、PMIC 选型说明，直接支撑硬件落地开发。
+
+- 芯片手册
+
+提供芯片核心技术参数，含技术规格书（Datasheet）、引脚定义表（PINOUT）、用户操作手册（User Manual）、产品简介（Brief），部分芯片补充配套 PMIC 手册等。
+
+#### 软件类文档
+
+- SDK 模块开发指南
+
+聚焦硬件接口驱动开发，包含 20 + 核心模块文档，如显示、音视频、存储与通信、高性能模块及系统基础，帮助开发者快速完成驱动适配。
+
+- 基础组件开发指南
+
+降低应用与系统配置门槛，涵盖系统部署、多媒体与图形、测试与工具、安全与异构，适配 AIoT 场景多样化需求。
+
+#### 工具类文档
+
+围绕 “提升开发效率、降低量产门槛”，提供工具生态与实操指南。
+
+#### 量产类文档
+
+针对产线实际痛点，提供全流程问题解决方案。
+
+- 量产前验证指南：含物料验证流程、试量产稳定性 Checklist，帮助用户前置规避物料兼容、方案稳定性风险。
+
+- 产线问题排查指南：覆盖启动烧写、MMC/eMMC 存储、IO 接口、显示、安全等核心场景的故障定位步骤，附典型问题案例与解决方案，提升产线问题解决效率。
+
+- 量产流程规范：提供全志 T 系列芯片生产指南、ESD（静电防护）操作规范、不良品分析流程，明确生产各环节的标准操作与合规要求，保障量产过程的一致性与产品良率。

docs/cubie/a7a/download.md

@@ -45,3 +45,61 @@ SD卡启动盘制作工具：
 
 - [原理图 V1.10](https://dl.radxa.com/cubie/a7a/docs/hw/radxa_cubie_a7a_v1.10_schematic.pdf)
 - [位号图 V1.10](https://dl.radxa.com/cubie/a7a/docs/hw/radxa_cubie_a7a_v1.10_Components_Placement_map.pdf)
+
+## 参考资料
+
+### [Tina5.0 AIoT 文档](https://gitlab.com/tina5.0_aiot/product/docs/)
+
+:::tip
+
+[Tina5.0 AIoT 文档](https://gitlab.com/tina5.0_aiot/product/docs/) 以中文版本为主！
+
+:::
+
+该文档是全志 A 系列（A527、A733 等）与 T 系列（T527 等）芯片的配套技术支持文档体系，与 Tina5.0 AIoT 文档深度联动，覆盖芯片从 “硬件设计 → 软件开发 → 工具适配 → 量产落地” 的全生命周期，其核心目标用户包括：
+
+1. 硬件工程师：支撑硬件方案设计与落地
+
+2. Linux/AIoT 软件开发者：适配 Tina5.0 SDK 的驱动与应用开发
+
+3. 产线技术人员：解决量产环节的实操问题
+
+4. 合规采购人员：获取物料兼容性与环保认证信息
+
+#### 硬件类文档
+
+- 硬件物料清单
+
+明确芯片兼容的核心物料范围，含 Camera 模组、LCD/eDP 屏幕、Wi-Fi/BT 模块、Input Sensor、DRAM、eMMC/NAND 存储等的支持列表与选型指导，确保选型准确性。
+
+- 硬件设计资源
+
+提供可直接复用的设计模板与规范，包括标案原理图、开发板 / 原型机原理图、PCB 参考模板、设计指南及硬件 Checklist，同时配套 IBIS 模型、PMIC 选型说明，直接支撑硬件落地开发。
+
+- 芯片手册
+
+提供芯片核心技术参数，含技术规格书（Datasheet）、引脚定义表（PINOUT）、用户操作手册（User Manual）、产品简介（Brief），部分芯片补充配套 PMIC 手册等。
+
+#### 软件类文档
+
+- SDK 模块开发指南
+
+聚焦硬件接口驱动开发，包含 20 + 核心模块文档，如显示、音视频、存储与通信、高性能模块及系统基础，帮助开发者快速完成驱动适配。
+
+- 基础组件开发指南
+
+降低应用与系统配置门槛，涵盖系统部署、多媒体与图形、测试与工具、安全与异构，适配 AIoT 场景多样化需求。
+
+#### 工具类文档
+
+围绕 “提升开发效率、降低量产门槛”，提供工具生态与实操指南。
+
+#### 量产类文档
+
+针对产线实际痛点，提供全流程问题解决方案。
+
+- 量产前验证指南：含物料验证流程、试量产稳定性 Checklist，帮助用户前置规避物料兼容、方案稳定性风险。
+
+- 产线问题排查指南：覆盖启动烧写、MMC/eMMC 存储、IO 接口、显示、安全等核心场景的故障定位步骤，附典型问题案例与解决方案，提升产线问题解决效率。
+
+- 量产流程规范：提供全志 T 系列芯片生产指南、ESD（静电防护）操作规范、不良品分析流程，明确生产各环节的标准操作与合规要求，保障量产过程的一致性与产品良率。

docs/cubie/a7z/download.md

@@ -45,3 +45,61 @@ SD卡启动盘制作工具：
 
 - [原理图 V1.10](https://dl.radxa.com/cubie/a7z/docs/hw/radxa_Cubie_A7Z_v1100__schematic.pdf)
 - [位号图 V1.10](https://dl.radxa.com/cubie/a7z/docs/hw/radxa_Cubie_A7Z_v1100_Components_Placement_map.pdf)
+
+## 参考资料
+
+### [Tina5.0 AIoT 文档](https://gitlab.com/tina5.0_aiot/product/docs/)
+
+:::tip
+
+[Tina5.0 AIoT 文档](https://gitlab.com/tina5.0_aiot/product/docs/) 以中文版本为主！
+
+:::
+
+该文档是全志 A 系列（A527、A733 等）与 T 系列（T527 等）芯片的配套技术支持文档体系，与 Tina5.0 AIoT 文档深度联动，覆盖芯片从 “硬件设计 → 软件开发 → 工具适配 → 量产落地” 的全生命周期，其核心目标用户包括：
+
+1. 硬件工程师：支撑硬件方案设计与落地
+
+2. Linux/AIoT 软件开发者：适配 Tina5.0 SDK 的驱动与应用开发
+
+3. 产线技术人员：解决量产环节的实操问题
+
+4. 合规采购人员：获取物料兼容性与环保认证信息
+
+#### 硬件类文档
+
+- 硬件物料清单
+
+明确芯片兼容的核心物料范围，含 Camera 模组、LCD/eDP 屏幕、Wi-Fi/BT 模块、Input Sensor、DRAM、eMMC/NAND 存储等的支持列表与选型指导，确保选型准确性。
+
+- 硬件设计资源
+
+提供可直接复用的设计模板与规范，包括标案原理图、开发板 / 原型机原理图、PCB 参考模板、设计指南及硬件 Checklist，同时配套 IBIS 模型、PMIC 选型说明，直接支撑硬件落地开发。
+
+- 芯片手册
+
+提供芯片核心技术参数，含技术规格书（Datasheet）、引脚定义表（PINOUT）、用户操作手册（User Manual）、产品简介（Brief），部分芯片补充配套 PMIC 手册等。
+
+#### 软件类文档
+
+- SDK 模块开发指南
+
+聚焦硬件接口驱动开发，包含 20 + 核心模块文档，如显示、音视频、存储与通信、高性能模块及系统基础，帮助开发者快速完成驱动适配。
+
+- 基础组件开发指南
+
+降低应用与系统配置门槛，涵盖系统部署、多媒体与图形、测试与工具、安全与异构，适配 AIoT 场景多样化需求。
+
+#### 工具类文档
+
+围绕 “提升开发效率、降低量产门槛”，提供工具生态与实操指南。
+
+#### 量产类文档
+
+针对产线实际痛点，提供全流程问题解决方案。
+
+- 量产前验证指南：含物料验证流程、试量产稳定性 Checklist，帮助用户前置规避物料兼容、方案稳定性风险。
+
+- 产线问题排查指南：覆盖启动烧写、MMC/eMMC 存储、IO 接口、显示、安全等核心场景的故障定位步骤，附典型问题案例与解决方案，提升产线问题解决效率。
+
+- 量产流程规范：提供全志 T 系列芯片生产指南、ESD（静电防护）操作规范、不良品分析流程，明确生产各环节的标准操作与合规要求，保障量产过程的一致性与产品良率。

i18n/en/docusaurus-plugin-content-docs/current/cubie/a5e/download.md

@@ -68,3 +68,58 @@ We strongly recommend that beginners download GPT format Radxa OS official image
 - [Schematic V1.20](https://dl.radxa.com/cubie/a5e/docs/hw/v1.2/radxa_cubie_a5e_schematic_v1.2_20250113.pdf)
 - [Component Placement Map V1.20](https://dl.radxa.com/cubie/a5e/docs/hw/v1.2/radxa_cubie_a5e_components_placement_map_v1.2_20250113.pdf)
 - [3D Files V1.20](https://dl.radxa.com/cubie/a5e/docs/hw/v1.2/radxa_cubie_a5e_pcba_3d_v1.2_stp_20250224.zip)
+
+## References Documentation
+
+### [Tina5.0 AIoT Documentation](https://gitlab.com/tina5.0_aiot/product/docs/)
+
+:::tip
+
+Note: The [Tina5.0 AIoT Documentation](https://gitlab.com/tina5.0_aiot/product/docs/) is primarily available in Chinese.
+
+:::
+
+This documentation system provides comprehensive technical support for Allwinner A-series (A527, A733, etc.) and T-series (T527, etc.) chips. Deeply integrated with Tina5.0 AIoT documentation, it covers the entire product lifecycle from "Hardware Design → Software Development → Tool Adaptation → Mass Production." The primary target users include:
+
+1. **Hardware Engineers**: Supporting hardware solution design and implementation
+2. **Linux/AIoT Software Developers**: Adapting drivers and applications for Tina5.0 SDK
+3. **Production Line Technicians**: Addressing practical issues in mass production
+4. **Compliance and Procurement Personnel**: Accessing material compatibility and environmental certification information
+
+#### Hardware Documentation
+
+- **Bill of Materials (BOM)**
+
+  Defines the core material compatibility range, including supported components such as camera modules, LCD/eDP displays, Wi-Fi/BT modules, input sensors, DRAM, eMMC/NAND storage, etc. Provides selection guidance to ensure component compatibility.
+
+- **Hardware Design Resources**
+
+  Offers reusable design templates and specifications, including reference schematics, development board/prototype schematics, PCB reference designs, design guidelines, and hardware checklists. Also includes IBIS models and PMIC selection guides to directly support hardware development.
+
+- **Chip Manuals**
+
+  Provides core technical parameters, including datasheets, pinout definitions, user manuals, product briefs, and supplementary PMIC manuals for specific chips.
+
+#### Software Documentation
+
+- **SDK Module Development Guide**
+
+  Focuses on hardware interface driver development, featuring documentation for 20+ core modules including display, audio/video, storage and communication, high-performance modules, and system fundamentals. Helps developers quickly complete driver adaptation.
+
+- **Basic Component Development Guide**
+
+  Simplifies application and system configuration, covering system deployment, multimedia and graphics, testing and tools, security, and heterogeneous computing to meet diverse AIoT scenario requirements.
+
+#### Tools Documentation
+
+Centered on "improving development efficiency and lowering the barrier to mass production," provides a tool ecosystem and practical guidelines.
+
+#### Mass Production Documentation
+
+Offers end-to-end solutions for common production line challenges.
+
+- **Pre-Production Verification Guide**: Includes material verification processes and pilot production stability checklists to help users preemptively address material compatibility and solution stability risks.
+
+- **Production Line Troubleshooting Guide**: Covers fault diagnosis steps for critical scenarios such as bootloader programming, MMC/eMMC storage, I/O interfaces, display, and security. Includes typical case studies and solutions to enhance production line issue resolution efficiency.
+
+- **Mass Production Process Standards**: Provides production guidelines for Allwinner T-series chips, ESD (Electrostatic Discharge) operation specifications, and defective product analysis procedures. Defines standard operations and compliance requirements for each production stage to ensure consistency and product yield.

i18n/en/docusaurus-plugin-content-docs/current/cubie/a7a/download.md

@@ -45,3 +45,58 @@ System Flashing Tools:
 
 - [Schematic V1.10](https://dl.radxa.com/cubie/a7a/docs/hw/radxa_cubie_a7a_v1.10_schematic.pdf)
 - [Component Placement Map V1.10](https://dl.radxa.com/cubie/a7a/docs/hw/radxa_cubie_a7a_v1.10_Components_Placement_map.pdf)
+
+## References Documentation
+
+### [Tina5.0 AIoT Documentation](https://gitlab.com/tina5.0_aiot/product/docs/)
+
+:::tip
+
+Note: The [Tina5.0 AIoT Documentation](https://gitlab.com/tina5.0_aiot/product/docs/) is primarily available in Chinese.
+
+:::
+
+This documentation system provides comprehensive technical support for Allwinner A-series (A527, A733, etc.) and T-series (T527, etc.) chips. Deeply integrated with Tina5.0 AIoT documentation, it covers the entire product lifecycle from "Hardware Design → Software Development → Tool Adaptation → Mass Production." The primary target users include:
+
+1. **Hardware Engineers**: Supporting hardware solution design and implementation
+2. **Linux/AIoT Software Developers**: Adapting drivers and applications for Tina5.0 SDK
+3. **Production Line Technicians**: Addressing practical issues in mass production
+4. **Compliance and Procurement Personnel**: Accessing material compatibility and environmental certification information
+
+#### Hardware Documentation
+
+- **Bill of Materials (BOM)**
+
+  Defines the core material compatibility range, including supported components such as camera modules, LCD/eDP displays, Wi-Fi/BT modules, input sensors, DRAM, eMMC/NAND storage, etc. Provides selection guidance to ensure component compatibility.
+
+- **Hardware Design Resources**
+
+  Offers reusable design templates and specifications, including reference schematics, development board/prototype schematics, PCB reference designs, design guidelines, and hardware checklists. Also includes IBIS models and PMIC selection guides to directly support hardware development.
+
+- **Chip Manuals**
+
+  Provides core technical parameters, including datasheets, pinout definitions, user manuals, product briefs, and supplementary PMIC manuals for specific chips.
+
+#### Software Documentation
+
+- **SDK Module Development Guide**
+
+  Focuses on hardware interface driver development, featuring documentation for 20+ core modules including display, audio/video, storage and communication, high-performance modules, and system fundamentals. Helps developers quickly complete driver adaptation.
+
+- **Basic Component Development Guide**
+
+  Simplifies application and system configuration, covering system deployment, multimedia and graphics, testing and tools, security, and heterogeneous computing to meet diverse AIoT scenario requirements.
+
+#### Tools Documentation
+
+Centered on "improving development efficiency and lowering the barrier to mass production," provides a tool ecosystem and practical guidelines.
+
+#### Mass Production Documentation
+
+Offers end-to-end solutions for common production line challenges.
+
+- **Pre-Production Verification Guide**: Includes material verification processes and pilot production stability checklists to help users preemptively address material compatibility and solution stability risks.
+
+- **Production Line Troubleshooting Guide**: Covers fault diagnosis steps for critical scenarios such as bootloader programming, MMC/eMMC storage, I/O interfaces, display, and security. Includes typical case studies and solutions to enhance production line issue resolution efficiency.
+
+- **Mass Production Process Standards**: Provides production guidelines for Allwinner T-series chips, ESD (Electrostatic Discharge) operation specifications, and defective product analysis procedures. Defines standard operations and compliance requirements for each production stage to ensure consistency and product yield.